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China2-382712-1
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
2-382712-1
BESCHREIBUNG
CONN IC DIP SOCKET 16POS TIN
DETAILIERTE BESCHREIBUNG
16 (2 x 8) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Tin Through Hole
HERSTELLER
TE Connectivity AMP Connectors
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
26
Lagerbestände
Technische Daten
Mfr
TE Connectivity AMP Connectors
Series
Diplomate DL
Package
Tube
Product Status
Obsolete
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
16 (2 x 8)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Tin
Contact Finish Thickness - Mating
-
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
-
Contact Material - Post
Beryllium Copper
Housing Material
Thermoplastic, Glass Filled
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.128" (3.24mm)
Material Flammability Rating
UL94 V-0
Contact Resistance
30mOhm
Umweltverträgliche Exportklassifikationen
RoHS Status
Not applicable
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
A118692
-2-382712-1-SI
Kategorie
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 2-382712-1
Dokumente und Medien
PCN Obsolescence/ EOL
1(Socket product 01/Jul/2014)
HTML Datasheet
1(382712 Drawing)
Product Drawings
1(382712 Drawing)
Menge Preis
-
Stellvertreter
-