Übersicht der Teilenummer

TEILNUMMER DES HERSTELLERS
44-3551-18
BESCHREIBUNG
CONN IC DIP SOCKET ZIF 44POS
DETAILIERTE BESCHREIBUNG
44 (2 x 22) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Nickel Boron Through Hole
HERSTELLER
Aries Electronics
STANDARD LEADTIME
6 Weeks
EDACAD-MODELL
STANDARDPAKET

Technische Daten

Mfr
Aries Electronics
Series
55
Package
Bulk
Product Status
Active
Type
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
44 (2 x 22)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Nickel Boron
Contact Finish Thickness - Mating
50.0µin (1.27µm)
Contact Material - Mating
Beryllium Nickel
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Nickel Boron
Contact Finish Thickness - Post
50.0µin (1.27µm)
Contact Material - Post
Beryllium Nickel
Housing Material
Polyetheretherketone (PEEK), Glass Filled
Operating Temperature
-55°C ~ 250°C
Termination Post Length
0.110" (2.78mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
-
Base Product Number
44-3551

Umweltverträgliche Exportklassifikationen

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040

Andere Namen

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Kategorie

/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 44-3551-18

Dokumente und Medien

Environmental Information
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Menge Preis

QUANTITÄT: 7
Einzelpreis: $153.99714
Verpackung: Bulk
MinMultiplikator: 7

Stellvertreter

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