English
Spain
Rusia
Italy
ChinaPA0243-S
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
PA0243-S
BESCHREIBUNG
BGA-4 STENCIL
DETAILIERTE BESCHREIBUNG
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
Proto-Advantage PA
Package
Bulk
Product Status
Active
Type
BGA
Number of Positions
4
Pitch
0.031" (0.80mm)
Outer Dimension
1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension
0.063" L x 0.063" W (1.60mm x 1.60mm)
Thermal Center Pad
-
Material
Stainless Steel
Thickness
0.0040" (0.102mm)
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
7218.10.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder Stencils, Templates/Chip Quik Inc. PA0243-S
Dokumente und Medien
Datasheets
()
Video File
1(Prototyping with Solder Stencils - Another Teaching Moment | allaboutcomponents.com Electronics)
Featured Product
1(Adapters, Breadboards, and Accessories)
HTML Datasheet
()
Menge Preis
QUANTITÄT: 1
Einzelpreis: $11.59
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-