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China818-AG11SM
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
818-AG11SM
BESCHREIBUNG
CONN IC DIP SOCKET 18POS GOLD
DETAILIERTE BESCHREIBUNG
18 (2 x 9) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Surface Mount
HERSTELLER
TE Connectivity AMP Connectors
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
234
Lagerbestände
Technische Daten
Mfr
TE Connectivity AMP Connectors
Series
800
Package
Bulk
Product Status
Active
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
18 (2 x 9)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
-
Contact Material - Mating
Copper Alloy
Mounting Type
Surface Mount
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin-Lead
Contact Finish Thickness - Post
-
Contact Material - Post
Copper Alloy
Housing Material
Thermoplastic, Polyester
Operating Temperature
-
Termination Post Length
-
Material Flammability Rating
UL94 V-0
Contact Resistance
-
Base Product Number
818
Umweltverträgliche Exportklassifikationen
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
-
Kategorie
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 818-AG11SM
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Menge Preis
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