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Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
32-6574-11
BESCHREIBUNG
CONN IC DIP SOCKET ZIF 32POS TIN
DETAILIERTE BESCHREIBUNG
32 (2 x 16) Pos DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Socket Tin Through Hole
HERSTELLER
Aries Electronics
STANDARD LEADTIME
5 Weeks
EDACAD-MODELL
STANDARDPAKET
10
Lagerbestände
Technische Daten
Mfr
Aries Electronics
Series
57
Package
Bulk
Product Status
Active
Type
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
32 (2 x 16)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Tin
Contact Finish Thickness - Mating
200.0µin (5.08µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Beryllium Copper
Housing Material
Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature
-
Termination Post Length
0.110" (2.78mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
-
Base Product Number
32-6574
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
A444-NDR
A444
Kategorie
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 32-6574-11
Dokumente und Medien
Datasheets
1(57 Series)
Environmental Information
()
HTML Datasheet
1(57 Series)
Product Drawings
1(6574 Series)
Menge Preis
QUANTITÄT: 20
Einzelpreis: $24.6905
Verpackung: Bulk
MinMultiplikator: 20
Verpackung: Bulk
MinMultiplikator: 20
Stellvertreter
-