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ChinaBSM300D12P2E001
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
BSM300D12P2E001
BESCHREIBUNG
SIC 2N-CH 1200V 300A MODULE
DETAILIERTE BESCHREIBUNG
Mosfet Array 1200V (1.2kV) 300A (Tc) 1875W Chassis Mount Module
HERSTELLER
Rohm Semiconductor
STANDARD LEADTIME
17 Weeks
EDACAD-MODELL
BSM300D12P2E001 Models
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Rohm Semiconductor
Series
-
Package
Tray
Product Status
Active
Technology
Silicon Carbide (SiC)
Configuration
2 N-Channel (Half Bridge)
FET Feature
-
Drain to Source Voltage (Vdss)
1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C
300A (Tc)
Rds On (Max) @ Id, Vgs
-
Vgs(th) (Max) @ Id
4V @ 68mA
Gate Charge (Qg) (Max) @ Vgs
-
Input Capacitance (Ciss) (Max) @ Vds
35000pF @ 10V
Power - Max
1875W
Operating Temperature
-40°C ~ 150°C (TJ)
Mounting Type
Chassis Mount
Package / Case
Module
Supplier Device Package
Module
Base Product Number
BSM300
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8541.29.0095
Andere Namen
-
Kategorie
/Product Index/Discrete Semiconductor Products/Transistors/FETs, MOSFETs/FET, MOSFET Arrays/Rohm Semiconductor BSM300D12P2E001
Dokumente und Medien
Datasheets
()
Other Related Documents
1(SiCPMEtype Inner Structure)
Product Training Modules
()
Video File
()
Environmental Information
()
Featured Product
()
PCN Assembly/Origin
1(BSM300D/BSM400D 20/Jan/2020)
HTML Datasheet
()
EDA Models
1(BSM300D12P2E001 Models)
Simulation Models
1(BSM300D12P2E001 Spice Model)
Reliability Documents
1(SiC PM Reliability Test)
Menge Preis
QUANTITÄT: 12
Einzelpreis: $714.68333
Verpackung: Tray
MinMultiplikator: 1
Verpackung: Tray
MinMultiplikator: 1
QUANTITÄT: 1
Einzelpreis: $740.51
Verpackung: Tray
MinMultiplikator: 1
Verpackung: Tray
MinMultiplikator: 1
Stellvertreter
-