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ChinaMMF006630
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
MMF006630
BESCHREIBUNG
1240-FPA SILVER SOLDER PASTE --
DETAILIERTE BESCHREIBUNG
Lead Free Solder Paste Ag40Cu30Zn28Ni2 (40/30/28/2) Jar, 1 oz (28g)
HERSTELLER
Micro-Measurements (Division of Vishay Precision Group)
STANDARD LEADTIME
18 Weeks
EDACAD-MODELL
STANDARDPAKET
1
Lagerbestände
Technische Daten
Mfr
Micro-Measurements (Division of Vishay Precision Group)
Series
-
Package
Jar
Product Status
Active
Type
Solder Paste
Composition
Ag40Cu30Zn28Ni2 (40/30/28/2)
Diameter
-
Melting Point
1220 ~ 1435°F (660 ~ 780°C)
Flux Type
-
Wire Gauge
-
Mesh Type
-
Process
Lead Free
Form
Jar, 1 oz (28g)
Shelf Life
9 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
41°F ~ 77°F (5°C ~ 25°C)
Umweltverträgliche Exportklassifikationen
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
EAR99
HTSUS
3810.10.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Micro-Measurements (Division of Vishay Precision Group) MMF006630
Dokumente und Medien
Datasheets
1(Solders, Accessories Datasheet)
MSDS Material Safety Datasheet
1(1240 FPA Silver Solder)
HTML Datasheet
1(Solders, Accessories Datasheet)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $190.9
Verpackung: Jar
MinMultiplikator: 1
Verpackung: Jar
MinMultiplikator: 1
Stellvertreter
-