English
Spain
Rusia
Italy
China2-641604-2
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
2-641604-2
BESCHREIBUNG
CONN IC DIP SOCKET 24POS GOLD
DETAILIERTE BESCHREIBUNG
24 (2 x 12) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
HERSTELLER
TE Connectivity AMP Connectors
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
17
Lagerbestände
Technische Daten
Mfr
TE Connectivity AMP Connectors
Series
Diplomate DL
Package
Tube
Product Status
Obsolete
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
24 (2 x 12)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
30.0µin (0.76µm)
Contact Material - Post
Beryllium Copper
Housing Material
Thermoplastic, Glass Filled
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.128" (3.24mm)
Material Flammability Rating
UL94 V-0
Contact Resistance
30mOhm
Base Product Number
641604
Umweltverträgliche Exportklassifikationen
RoHS Status
Not applicable
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
2-641604-2-ND
A24798
-2-641604-2-SI
26416042
Kategorie
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 2-641604-2
Dokumente und Medien
Datasheets
1(641604)
3D Drawings
1(2-641604-2.pdf)
Product Drawings
()
Menge Preis
-
Stellvertreter
-