Übersicht der Teilenummer

TEILNUMMER DES HERSTELLERS
MSCGTQ100HD65C1AG
BESCHREIBUNG
PM-IGBT-TFS-SBD~-SP1F
DETAILIERTE BESCHREIBUNG
IGBT Module Trench Half Bridge 650 V 80 A Chassis Mount SP1
HERSTELLER
Microchip Technology
STANDARD LEADTIME
37 Weeks
EDACAD-MODELL
STANDARDPAKET
1

Technische Daten

Mfr
Microchip Technology
Series
MSC
Package
Tube
Product Status
Active
IGBT Type
Trench
Configuration
Half Bridge
Voltage - Collector Emitter Breakdown (Max)
650 V
Current - Collector (Ic) (Max)
80 A
Vce(on) (Max) @ Vge, Ic
-
Current - Collector Cutoff (Max)
80 A
Input
Standard
NTC Thermistor
No
Operating Temperature
-
Mounting Type
Chassis Mount
Package / Case
Module
Supplier Device Package
SP1
Base Product Number
MSCGTQ100

Umweltverträgliche Exportklassifikationen

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8541.29.0095

Andere Namen

-

Kategorie

/Product Index/Discrete Semiconductor Products/Transistors/IGBTs/IGBT Modules/Microchip Technology MSCGTQ100HD65C1AG

Dokumente und Medien

Datasheets
1(Power Discrete, Module Portfolio)
Environmental Information
()
PCN Assembly/Origin
1(Assembly Site 08/Aug/2023)

Menge Preis

QUANTITÄT: 100
Einzelpreis: $109.4875
Verpackung: Tube
MinMultiplikator: 1
QUANTITÄT: 1
Einzelpreis: $131.38
Verpackung: Tube
MinMultiplikator: 1

Stellvertreter

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