English
Spain
Rusia
Italy
China67SLG050050030PI00
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
67SLG050050030PI00
BESCHREIBUNG
METAL FILM OVER FOAM CONTACTS
DETAILIERTE BESCHREIBUNG
HERSTELLER
Laird Technologies EMI
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
1,500
Lagerbestände
Technische Daten
Mfr
Laird Technologies EMI
Series
SMD Grounding Metallized
Package
Tape & Reel (TR)
Product Status
Active
Type
Film Over Foam
Shape
Rectangle
Width
0.197" (5.00mm)
Length
0.118" (3.00mm)
Height
0.197" (5.00mm)
Material
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Plating
-
Plating - Thickness
-
Attachment Method
Solder
Operating Temperature
-40°C ~ 70°C
Shelf Life Start
-
Shelf Life
-
Storage/Refrigeration Temperature
-
Umweltverträgliche Exportklassifikationen
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
ECCN
EAR99
HTSUS
8536.90.4000
Andere Namen
903-1590-6
903-1590-1
903-1590-2
Kategorie
/Product Index/RF and Wireless/RFI and EMI - Contacts, Fingerstock and Gaskets/Laird Technologies EMI 67SLG050050030PI00
Dokumente und Medien
Datasheets
()
Video File
1(Laird’s Precision Metals Production and Design Capabilities Overview)
HTML Datasheet
1(Soft SMD Grounding Contacts)
Menge Preis
-
Stellvertreter
-