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TEILNUMMER DES HERSTELLERS
40-3554-18
BESCHREIBUNG
CONN IC DIP SOCKET ZIF 40POS
DETAILIERTE BESCHREIBUNG
40 (2 x 20) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Nickel Boron Through Hole
HERSTELLER
Aries Electronics
STANDARD LEADTIME
6 Weeks
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Aries Electronics
Series
55
Package
Bulk
Product Status
Active
Type
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
40 (2 x 20)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Nickel Boron
Contact Finish Thickness - Mating
50.0µin (1.27µm)
Contact Material - Mating
Beryllium Nickel
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Nickel Boron
Contact Finish Thickness - Post
50.0µin (1.27µm)
Contact Material - Post
Beryllium Nickel
Housing Material
Polyetheretherketone (PEEK), Glass Filled
Operating Temperature
-55°C ~ 250°C
Termination Post Length
0.110" (2.78mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
-
Base Product Number
40-3554
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
-
Kategorie
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 40-3554-18
Dokumente und Medien
Environmental Information
()
Menge Preis
QUANTITÄT: 7
Einzelpreis: $140.29571
Verpackung: Bulk
MinMultiplikator: 7
Verpackung: Bulk
MinMultiplikator: 7
Stellvertreter
-