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TEILNUMMER DES HERSTELLERS
7131-108-18
BESCHREIBUNG
SOCKET ADAPT HB2E RELAY TO 8DIP
DETAILIERTE BESCHREIBUNG
IC Socket Adapter HB2E Relay To DIP, 0.3" (7.62mm) Row Spacing Through Hole
HERSTELLER
Aries Electronics
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Aries Electronics
Series
-
Package
Bulk
Product Status
Active
Convert From (Adapter End)
HB2E Relay
Convert To (Adapter End)
DIP, 0.3" (7.62mm) Row Spacing
Number of Pins
8
Pitch - Mating
-
Contact Finish - Mating
-
Mounting Type
Through Hole
Termination
Solder
Pitch - Post
-
Contact Finish - Post
Tin-Lead
Housing Material
-
Board Material
FR4 Epoxy Glass
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
-
Features
-
Operating Temperature
-
Contact Material - Mating
-
Contact Material - Post
Brass
Contact Finish Thickness - Mating
-
Contact Finish Thickness - Post
200.0µin (5.08µm)
Base Product Number
7131-10
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
-
Kategorie
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/Socket Adapters/Aries Electronics 7131-108-18
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Menge Preis
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Stellvertreter
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