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Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
TC3-1G
BESCHREIBUNG
HEAT SINK THERMAL COMPOUND
DETAILIERTE BESCHREIBUNG
Thermal Silicone Compound 1 gram Syringe
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET
1
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
CHIPQUIK®
Package
Bulk
Product Status
Active
Type
Silicone Compound
Size / Dimension
1 gram Syringe
Usable Temperature Range
-40°F ~ 302°F (-40°C ~ 150°C)
Color
Gray
Thermal Conductivity
8.50W/m-K
Features
-
Shelf Life
60 Months
Storage/Refrigeration Temperature
37°F ~ 77°F (3°C ~ 25°C)
Material Flammability Rating
-
Shelf Life Start
Date of Manufacture
Shipping Info
-
allaboutcomponents.com Storage
-
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
3810.10.0000
Andere Namen
-
Kategorie
/Product Index/Fans, Thermal Management/Thermal/Adhesives, Epoxies, Greases, Pastes/Chip Quik Inc. TC3-1G
Dokumente und Medien
Datasheets
1(TC3-1G Datasheet)
Featured Product
1(TC3 Ultra Max™ Thermal Compound)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $5.95
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-