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ChinaBGA0007-S
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
BGA0007-S
BESCHREIBUNG
STENCIL BGA-100 1.27MM
DETAILIERTE BESCHREIBUNG
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
2 Weeks
EDACAD-MODELL
STANDARDPAKET
1
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
Proto-Advantage BGA
Package
Bulk
Product Status
Active
Type
BGA
Number of Positions
100
Pitch
0.050" (1.27mm)
Outer Dimension
1.950" L x 1.350" W (49.53mm x 34.29mm)
Inner Dimension
-
Thermal Center Pad
-
Material
Stainless Steel
Thickness
0.0040" (0.102mm)
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8515.19.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder Stencils, Templates/Chip Quik Inc. BGA0007-S
Dokumente und Medien
Datasheets
()
Video File
1(Prototyping with Solder Stencils - Another Teaching Moment | allaboutcomponents.com Electronics)
Featured Product
1(Adapters, Breadboards, and Accessories)
HTML Datasheet
()
Menge Preis
QUANTITÄT: 1
Einzelpreis: $20.99
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-