Übersicht der Teilenummer

TEILNUMMER DES HERSTELLERS
SMDSWLF.031 8OZ
BESCHREIBUNG
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
DETAILIERTE BESCHREIBUNG
Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 20 AWG, 22 SWG Spool, 8 oz (227g), 1/2 lb
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET
1

Technische Daten

Mfr
Chip Quik Inc.
Series
-
Package
Bulk
Product Status
Active
Type
Wire Solder
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
0.031" (0.79mm)
Melting Point
423 ~ 428°F (217 ~ 220°C)
Flux Type
No-Clean, Water Soluble
Wire Gauge
20 AWG, 22 SWG
Process
Lead Free
Form
Spool, 8 oz (227g), 1/2 lb
Shelf Life
-
Shelf Life Start
-
Storage/Refrigeration Temperature
-
allaboutcomponents.com Storage
-
Shipping Info
-
Base Product Number
SMDSW

Umweltverträgliche Exportklassifikationen

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.30.3000

Andere Namen

SMDSWLF.0318OZ
SMDSWLF.031 8OZ-ND

Kategorie

/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMDSWLF.031 8OZ

Dokumente und Medien

Datasheets
1(SMDSWLF.031 8OZ Datasheet)
MSDS Material Safety Datasheet
1(SMDSWLF.031 8OZ SDS)
HTML Datasheet
1(SMDSWLF.031 8OZ Datasheet)

Menge Preis

QUANTITÄT: 1
Einzelpreis: $56.91
Verpackung: Bulk
MinMultiplikator: 1

Stellvertreter

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