Übersicht der Teilenummer

TEILNUMMER DES HERSTELLERS
532-AG11D-ESL
BESCHREIBUNG
CONN IC DIP SOCKET 32POS GOLD
DETAILIERTE BESCHREIBUNG
32 (2 x 16) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
HERSTELLER
TE Connectivity AMP Connectors
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
375

Technische Daten

Mfr
TE Connectivity AMP Connectors
Series
500
Package
Tube
Product Status
Obsolete
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
32 (2 x 16)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
5.00µin (0.127µm)
Contact Material - Mating
Copper Alloy
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
-
Contact Material - Post
Copper Alloy
Housing Material
Polyester
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
10mOhm
Base Product Number
532

Umweltverträgliche Exportklassifikationen

RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040

Andere Namen

-532-AG11D-ESL-SI
A115560
6-1437536-5
6-1437536-5-ND

Kategorie

/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 532-AG11D-ESL

Dokumente und Medien

Datasheets
1(500 Series)
Environmental Information
1(6-1437536-5 Statement of Compliance)
PCN Obsolescence/ EOL
()

Menge Preis

-

Stellvertreter

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