English
Spain
Rusia
Italy
ChinaSMDAL50
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
SMDAL50
BESCHREIBUNG
ALUMINUM SOLDER PASTE WATER-SOLU
DETAILIERTE BESCHREIBUNG
Lead Free Water Soluble Solder Paste Sn96.5Ag3.5 (96.5/3.5) Jar, 1.76 oz (50g)
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
SMD
Package
Bulk
Product Status
Active
Type
Solder Paste
Composition
Sn96.5Ag3.5 (96.5/3.5)
Diameter
-
Melting Point
430°F (221°C)
Flux Type
Water Soluble
Wire Gauge
-
Mesh Type
3
Process
Lead Free
Form
Jar, 1.76 oz (50g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
Shipping Info
-
Base Product Number
SMDAL
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.90.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMDAL50
Dokumente und Medien
Datasheets
1(SMDAL50 Datasheet)
MSDS Material Safety Datasheet
1(SMDAL50 SDS)
Featured Product
1(SMDAL Aluminum Soldering Paste)
HTML Datasheet
1(SMDAL50 Datasheet)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $25.95
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-