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ChinaFF900R12IE4VPBOSA1
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
FF900R12IE4VPBOSA1
BESCHREIBUNG
IGBT MOD 1200V 900A 20MW
DETAILIERTE BESCHREIBUNG
IGBT Module Trench Field Stop Half Bridge 1200 V 900 A 20 mW Chassis Mount Module
HERSTELLER
Infineon Technologies
STANDARD LEADTIME
14 Weeks
EDACAD-MODELL
STANDARDPAKET
3
Lagerbestände
Technische Daten
Mfr
Infineon Technologies
Series
PrimePACK™2
Package
Tray
Product Status
Active
IGBT Type
Trench Field Stop
Configuration
Half Bridge
Voltage - Collector Emitter Breakdown (Max)
1200 V
Current - Collector (Ic) (Max)
900 A
Power - Max
20 mW
Vce(on) (Max) @ Vge, Ic
2.1V @ 15V, 900A
Current - Collector Cutoff (Max)
5 mA
Input Capacitance (Cies) @ Vce
54 nF @ 25 V
Input
Standard
NTC Thermistor
Yes
Operating Temperature
-40°C ~ 150°C
Mounting Type
Chassis Mount
Package / Case
Module
Supplier Device Package
Module
Base Product Number
FF900R12
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8541.29.0095
Andere Namen
SP001625368
FF900R12IE4VP
Kategorie
/Product Index/Discrete Semiconductor Products/Transistors/IGBTs/IGBT Modules/Infineon Technologies FF900R12IE4VPBOSA1
Dokumente und Medien
Datasheets
1(FF900R12IE4VP)
HTML Datasheet
1(FF900R12IE4VP)
Forum Discussions
1(What’s the suffix BOSA1 mean in Infineon FF600R12IE4BOSA1?)
Menge Preis
QUANTITÄT: 12
Einzelpreis: $520.15833
Verpackung: Tray
MinMultiplikator: 3
Verpackung: Tray
MinMultiplikator: 3
QUANTITÄT: 3
Einzelpreis: $540.47667
Verpackung: Tray
MinMultiplikator: 3
Verpackung: Tray
MinMultiplikator: 3
Stellvertreter
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