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ChinaCQ100GE 250G
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
CQ100GE 250G
BESCHREIBUNG
GERMANIUM DOPED SOLDER PASTE NO-
DETAILIERTE BESCHREIBUNG
Lead Free No-Clean Solder Paste Sn99.244Cu0.7 (Ni0.05/Ge0.006) Jar, 8.8 oz (250g)
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET
1
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
-
Package
Bulk
Product Status
Active
Type
Solder Paste
Composition
Sn99.244Cu0.7 (Ni0.05/Ge0.006)
Diameter
-
Melting Point
441°F (227°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Jar, 8.8 oz (250g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
allaboutcomponents.com Storage
Refrigerated
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Base Product Number
CQ100G
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.90.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. CQ100GE 250G
Dokumente und Medien
Datasheets
1(CQ100GE 250G Datasheet)
HTML Datasheet
1(CQ100GE 250G Datasheet)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $58.95
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-