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ChinaSBB0802P-1
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
SBB0802P-1
BESCHREIBUNG
SOLDER-IN BREADBOARD 1X1" (8 ROW
DETAILIERTE BESCHREIBUNG
Breadboard, General Purpose Plated Through Hole (PTH) Pad Per Hole (Round) 0.1" (2.54mm) Grid
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
Proto-Advantage
Package
Bulk
Product Status
Active
Proto Board Type
Breadboard, General Purpose
Plating
Plated Through Hole (PTH)
Pitch
0.1" (2.54mm) Grid
Circuit Pattern
Pad Per Hole (Round)
Edge Contacts
-
Hole Diameter
0.039" (1.00mm)
Size / Dimension
1.00" L x 1.00" W (25.4mm x 25.4mm)
Board Thickness
0.063" (1.60mm)
Material
FR4 Epoxy Glass
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8534.00.0040
Andere Namen
-
Kategorie
/Product Index/Prototyping, Fabrication Products/Prototype Boards Perforated/Chip Quik Inc. SBB0802P-1
Dokumente und Medien
-
Menge Preis
QUANTITÄT: 1
Einzelpreis: $2.38
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
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