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China808-AG10D-ES
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
808-AG10D-ES
BESCHREIBUNG
CONN IC DIP SOCKET 8POS GOLD
DETAILIERTE BESCHREIBUNG
8 (2 x 4) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
HERSTELLER
TE Connectivity AMP Connectors
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
1,200
Lagerbestände
Technische Daten
Mfr
TE Connectivity AMP Connectors
Series
800
Package
Tube
Product Status
Obsolete
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
8 (2 x 4)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
25.0µin (0.63µm)
Contact Material - Mating
Copper Alloy
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
-
Contact Finish Thickness - Post
-
Contact Material - Post
-
Housing Material
Polyester
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
10mOhm
Base Product Number
808
Umweltverträgliche Exportklassifikationen
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Affected
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
1437539-2
-808-AG10D-ES-SI
Kategorie
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 808-AG10D-ES
Dokumente und Medien
Environmental Information
1(1437539-2 Statement of Compliance)
PCN Obsolescence/ EOL
()
3D Drawings
1(1437539-2.pdf)
Product Drawings
1(800 Series Drawing)
Menge Preis
-
Stellvertreter
-