Übersicht der Teilenummer

TEILNUMMER DES HERSTELLERS
PA0027C
BESCHREIBUNG
UMAX-10/USOP-10/MSOP-10 TO DIP-1
DETAILIERTE BESCHREIBUNG
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET
1

Technische Daten

Mfr
Chip Quik Inc.
Series
Proto-Advantage
Package
Bulk
Product Status
Active
Proto Board Type
SMD to DIP
Package Accepted
MSOP, uMAX, uSOP
Number of Positions
10
Pitch
0.020" (0.50mm)
Board Thickness
0.063" (1.60mm)
Material
FR4 Epoxy Glass
Size / Dimension
0.500" L x 0.400" W (12.70mm x 10.16mm)
Base Product Number
PA0027

Umweltverträgliche Exportklassifikationen

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040

Andere Namen

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Kategorie

/Product Index/Prototyping, Fabrication Products/Adapter, Breakout Boards/Chip Quik Inc. PA0027C

Dokumente und Medien

Datasheets
1(PA0027C Datasheet)
HTML Datasheet
1(PA0027C Datasheet)

Menge Preis

QUANTITÄT: 1
Einzelpreis: $7.09
Verpackung: Bulk
MinMultiplikator: 1

Stellvertreter

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