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Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
2-382713-8
BESCHREIBUNG
CONN IC DIP SOCKET 18POS TIN
DETAILIERTE BESCHREIBUNG
18 (2 x 9) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Tin Through Hole
HERSTELLER
TE Connectivity AMP Connectors
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
TE Connectivity AMP Connectors
Series
Diplomate DL
Package
Box
Product Status
Active
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
18 (2 x 9)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Tin
Contact Finish Thickness - Mating
-
Contact Material - Mating
Phosphor Bronze
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
-
Contact Material - Post
Phosphor Bronze
Housing Material
Thermoplastic, Glass Filled
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.128" (3.24mm)
Material Flammability Rating
UL94 V-0
Contact Resistance
30mOhm
Base Product Number
382713
Umweltverträgliche Exportklassifikationen
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
-
Kategorie
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 2-382713-8
Dokumente und Medien
Datasheets
1(382713)
Environmental Information
1(2-382713-8 Statement of Compliance)
Menge Preis
-
Stellvertreter
-