English
Spain
Rusia
Italy
China522-AG11D
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
522-AG11D
BESCHREIBUNG
CONN IC DIP SOCKET 22POS GOLD
DETAILIERTE BESCHREIBUNG
22 (2 x 11) Pos DIP, 0.4" (10.16mm) Row Spacing Socket Gold Through Hole
HERSTELLER
TE Connectivity AMP Connectors
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
735
Lagerbestände
Technische Daten
Mfr
TE Connectivity AMP Connectors
Series
500
Package
Bulk
Product Status
Active
Type
DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid)
22 (2 x 11)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
25.0µin (0.63µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin-Lead
Contact Finish Thickness - Post
25.0µin (0.63µm)
Contact Material - Post
Brass, Copper
Housing Material
Polyester
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
10mOhm
Base Product Number
522-A
Umweltverträgliche Exportklassifikationen
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Affected
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
-
Kategorie
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 522-AG11D
Dokumente und Medien
-
Menge Preis
-
Stellvertreter
-