English
Spain
Rusia
Italy
ChinaTS991AX500T4
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
TS991AX500T4
BESCHREIBUNG
SOLDER PASTE THERMALLY STABLE NC
DETAILIERTE BESCHREIBUNG
Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 17.64 oz (500g)
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET
1
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
CHIPQUIK®
Package
Bulk
Product Status
Active
Type
Solder Paste
Composition
Sn63Pb37 (63/37)
Diameter
-
Melting Point
361°F (183°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Leaded
Form
Jar, 17.64 oz (500g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Base Product Number
TS991A
Umweltverträgliche Exportklassifikationen
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Affected
ECCN
EAR99
HTSUS
3810.10.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. TS991AX500T4
Dokumente und Medien
Datasheets
1(TS991AX500T4 Datasheet)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $105.77
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-