English
Spain
Rusia
Italy
ChinaSMD291AX250T3
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
SMD291AX250T3
BESCHREIBUNG
SOLDER PASTE SN63/PB37 250G
DETAILIERTE BESCHREIBUNG
Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 8.8 oz (250g)
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
-
Package
Jar
Product Status
Active
Type
Solder Paste
Composition
Sn63Pb37 (63/37)
Diameter
-
Melting Point
361°F (183°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
3
Process
Leaded
Form
Jar, 8.8 oz (250g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
allaboutcomponents.com Storage
Refrigerated
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Weight
0.551 lb (249.93 g)
Base Product Number
SMD291
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.30.6000
California Prop 65
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMD291AX250T3
Dokumente und Medien
Datasheets
1(SMD291AX250T3)
MSDS Material Safety Datasheet
1(SMD291AX, SMD4300AX, TS391AX)
HTML Datasheet
1(SMD291AX250T3)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $41.95
Verpackung: Jar
MinMultiplikator: 1
Verpackung: Jar
MinMultiplikator: 1
Stellvertreter
-