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ChinaTS391LT250
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
TS391LT250
BESCHREIBUNG
THERMALLY STABLE SOLDER PASTE NO
DETAILIERTE BESCHREIBUNG
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
3 Weeks
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
-
Package
Bulk
Product Status
Active
Type
Solder Paste
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter
-
Melting Point
281°F (138°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Jar, 8.8 oz (250g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
68°F ~ 77°F (20°C ~ 25°C)
Shipping Info
-
Base Product Number
TS391L
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
3810.10.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. TS391LT250
Dokumente und Medien
Datasheets
1(TS391LT250)
MSDS Material Safety Datasheet
1(TS391LT250 SDS)
Featured Product
1(Thermally Stable Solder Paste)
HTML Datasheet
1(TS391LT250)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $84.95
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-