English
Spain
Rusia
Italy
China520-AG10D-ES
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
520-AG10D-ES
BESCHREIBUNG
CONN IC DIP SOCKET 20POS GOLD
DETAILIERTE BESCHREIBUNG
20 (2 x 10) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
HERSTELLER
TE Connectivity AMP Connectors
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
960
Lagerbestände
Technische Daten
Mfr
TE Connectivity AMP Connectors
Series
500
Package
Tube
Product Status
Obsolete
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
20 (2 x 10)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
-
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
-
Contact Finish Thickness - Post
-
Contact Material - Post
Brass
Housing Material
-
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
-
Contact Resistance
10mOhm
Base Product Number
520
Umweltverträgliche Exportklassifikationen
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Affected
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
2-1437536-3-ND
2-1437536-3
Kategorie
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 520-AG10D-ES
Dokumente und Medien
Datasheets
1(500 Series)
Environmental Information
1(2-1437536-3 Statement of Compliance)
PCN Obsolescence/ EOL
1(DK OBS NOTICE)
Menge Preis
-
Stellvertreter
-