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ChinaRASWLF.031 1LB
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
RASWLF.031 1LB
BESCHREIBUNG
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
DETAILIERTE BESCHREIBUNG
Lead Free Rosin Activated (RA) Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 21 AWG, 20 SWG Spool, 1 lb (454 g)
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET
1
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
-
Package
Bulk
Product Status
Active
Type
Wire Solder
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
0.031" (0.79mm)
Melting Point
422 ~ 428°F (217 ~ 220°C)
Flux Type
Rosin Activated (RA)
Wire Gauge
21 AWG, 20 SWG
Process
Lead Free
Form
Spool, 1 lb (454 g)
Shelf Life
-
Base Product Number
RASW
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.30.6000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. RASWLF.031 1LB
Dokumente und Medien
Datasheets
1(RASWLF.031 1LB Datasheet)
MSDS Material Safety Datasheet
1(Lead Free Solder SDS)
HTML Datasheet
1(RASWLF.031 1LB Datasheet)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $94.85
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-