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Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
1051209
BESCHREIBUNG
63S4 MP218 ACP89V PASTE
DETAILIERTE BESCHREIBUNG
Leaded No-Clean Solder Paste Jar, 17.64 oz (500g)
HERSTELLER
Harimatec Inc.
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Harimatec Inc.
Series
MP218
Package
Bulk
Product Status
Obsolete
Type
Solder Paste
Diameter
-
Melting Point
-
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Leaded
Form
Jar, 17.64 oz (500g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
32°F ~ 50°F (0°C ~ 10°C)
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Umweltverträgliche Exportklassifikationen
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
Not Applicable
ECCN
EAR99
HTSUS
8311.90.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Harimatec Inc. 1051209
Dokumente und Medien
Datasheets
()
Product Training Modules
1(Introduction to Solder Paste)
MSDS Material Safety Datasheet
1(1051209 SDS)
PCN Obsolescence/ EOL
1(Closing of Sale of Henkel’s Solder Material Business 06/MAY/2022)
PCN Packaging
1(Henkel/Berquist Revised Brands 10/May/2016)
HTML Datasheet
()
Menge Preis
-
Stellvertreter
-