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China1-1825376-2
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
1-1825376-2
BESCHREIBUNG
CONN IC DIP SOCKET 28POS GOLD
DETAILIERTE BESCHREIBUNG
28 (2 x 14) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
HERSTELLER
TE Connectivity AMP Connectors
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
1,500
Lagerbestände
Technische Daten
Mfr
TE Connectivity AMP Connectors
Series
Diplomate DL
Package
Tray
Product Status
Active
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
28 (2 x 14)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
30.0µin (0.76µm)
Contact Material - Post
Beryllium Copper
Housing Material
Thermoplastic, Glass Filled
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.120" (3.05mm)
Material Flammability Rating
UL94 V-0
Contact Resistance
30mOhm
Base Product Number
1825376
Umweltverträgliche Exportklassifikationen
RoHS Status
Not applicable
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
A35059
2266-1-1825376-2
Kategorie
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 1-1825376-2
Dokumente und Medien
Datasheets
1(1825376)
Environmental Information
1(1-1825376-2 Statement of Compliance)
Menge Preis
-
Stellvertreter
-