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TEILNUMMER DES HERSTELLERS
SMDLTLFP15T4
BESCHREIBUNG
TWO PART MIX SOLDER PASTE
DETAILIERTE BESCHREIBUNG
Lead Free No-Clean Solder Paste, Two Part Mix Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 0.53 oz (15g)
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
-
Package
Jar
Product Status
Active
Type
Solder Paste, Two Part Mix
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter
-
Melting Point
281°F (138°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Jar, 0.53 oz (15g)
Shelf Life
24 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 77°F (3°C ~ 25°C)
Shipping Info
-
Base Product Number
SMDLTL
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
3810.10.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMDLTLFP15T4
Dokumente und Medien
Datasheets
()
Video File
1(Chip Quik’s - Patent Pending Two-Part Mix Solder Paste)
Featured Product
1(Patent Pending Two-Part Mix™ Solder Paste)
HTML Datasheet
()
Menge Preis
QUANTITÄT: 1
Einzelpreis: $19.95
Verpackung: Jar
MinMultiplikator: 1
Verpackung: Jar
MinMultiplikator: 1
Stellvertreter
-