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ChinaIPC0125-S
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
IPC0125-S
BESCHREIBUNG
QFN-24 STENCIL
DETAILIERTE BESCHREIBUNG
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
Proto-Advantage IPC
Package
Bulk
Product Status
Active
Type
QFN/LFCSP
Number of Positions
24
Pitch
0.020" (0.50mm)
Outer Dimension
1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension
0.177" L x 0.138" W (4.50mm x 3.50mm)
Thermal Center Pad
0.120" L x 0.081" W (3.05mm x 2.05mm)
Material
Stainless Steel
Thickness
0.0040" (0.102mm)
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
7218.10.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder Stencils, Templates/Chip Quik Inc. IPC0125-S
Dokumente und Medien
Datasheets
()
Video File
1(Prototyping with Solder Stencils - Another Teaching Moment | allaboutcomponents.com Electronics)
Featured Product
1(Adapters, Breadboards, and Accessories)
HTML Datasheet
()
Menge Preis
QUANTITÄT: 1
Einzelpreis: $11.59
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-