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Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
18-3503-20
BESCHREIBUNG
CONN IC DIP SOCKET 18POS GOLD
DETAILIERTE BESCHREIBUNG
18 (2 x 9) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
HERSTELLER
Aries Electronics
STANDARD LEADTIME
5 Weeks
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Aries Electronics
Series
503
Package
Bulk
Product Status
Active
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
18 (2 x 9)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Wire Wrap
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Phosphor Bronze
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.360" (9.14mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
-
Base Product Number
18-3503
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
-
Kategorie
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 18-3503-20
Dokumente und Medien
Datasheets
1(503 Series Lo-PRO file Socket)
Environmental Information
()
HTML Datasheet
1(503 Series Lo-PRO file Socket)
Menge Preis
QUANTITÄT: 61
Einzelpreis: $7.88705
Verpackung: Bulk
MinMultiplikator: 61
Verpackung: Bulk
MinMultiplikator: 61
Stellvertreter
-