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ChinaSC900841JVKR2
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
SC900841JVKR2
BESCHREIBUNG
IC POWER MGT 338-MAPBGA
DETAILIERTE BESCHREIBUNG
PC's, PDA's PMIC 338-TFBGA (11x11)
HERSTELLER
NXP USA Inc.
STANDARD LEADTIME
EDACAD-MODELL
SC900841JVKR2 Models
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
NXP USA Inc.
Series
-
Package
Tape & Reel (TR)
Product Status
Obsolete
Applications
PC's, PDA's
Current - Supply
-
Voltage - Supply
-
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
338-TFBGA
Supplier Device Package
338-TFBGA (11x11)
Base Product Number
SC900841
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Andere Namen
-
Kategorie
/Product Index/Integrated Circuits (ICs)/Power Management (PMIC)/Power Management - Specialized/NXP USA Inc. SC900841JVKR2
Dokumente und Medien
Datasheets
1(SC900841)
Environmental Information
()
PCN Obsolescence/ EOL
1(AMPD PMIC 04/Sept/2012)
PCN Packaging
1(All Dev Label Update 15/Dec/2020)
EDA Models
1(SC900841JVKR2 Models)
Menge Preis
-
Stellvertreter
-