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ChinaSMDSWLF.008 50G
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
SMDSWLF.008 50G
BESCHREIBUNG
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
DETAILIERTE BESCHREIBUNG
Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 32 AWG, 35 SWG Spool, 1.76 oz (50g)
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET
1
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
SMD
Package
Bulk
Product Status
Active
Type
Wire Solder
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
0.008" (0.20mm)
Melting Point
423 ~ 428°F (217 ~ 220°C)
Flux Type
No-Clean, Water Soluble
Wire Gauge
32 AWG, 35 SWG
Process
Lead Free
Form
Spool, 1.76 oz (50g)
Shelf Life
-
Shelf Life Start
-
Storage/Refrigeration Temperature
-
allaboutcomponents.com Storage
-
Shipping Info
-
Base Product Number
SMDSW
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.30.3000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMDSWLF.008 50G
Dokumente und Medien
Datasheets
1(SMDSWLF.008 50G Datasheet)
MSDS Material Safety Datasheet
1(LF Solder Wire SDS)
Featured Product
1(Ultra-Thin Series Solder Wire)
HTML Datasheet
1(SMDSWLF.008 50G Datasheet)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $71.99
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-