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China608-CG1T
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
608-CG1T
BESCHREIBUNG
CONN IC DIP SOCKET 8POS GOLD
DETAILIERTE BESCHREIBUNG
8 (2 x 4) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Tin Through Hole
HERSTELLER
TE Connectivity AMP Connectors
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
150
Lagerbestände
Technische Daten
Mfr
TE Connectivity AMP Connectors
Series
600
Package
Bulk
Product Status
Obsolete
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
8 (2 x 4)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Tin
Contact Finish Thickness - Mating
-
Contact Material - Mating
-
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
-
Contact Material - Post
Phosphor Bronze
Housing Material
Thermoplastic, Polyester
Operating Temperature
-65°C ~ 125°C
Termination Post Length
0.158" (4.01mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
5 A
Contact Resistance
-
Base Product Number
608
Umweltverträgliche Exportklassifikationen
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
1-1437515-3
A130916
608-CG1T-ND
Kategorie
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 608-CG1T
Dokumente und Medien
Datasheets
1(600 Series Datasheet)
PCN Obsolescence/ EOL
()
Menge Preis
-
Stellvertreter
-