English
Spain
Rusia
Italy
ChinaSMD4300SNL250T3
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
SMD4300SNL250T3
BESCHREIBUNG
SOLDER PASTE SAC305 250G T3
DETAILIERTE BESCHREIBUNG
Lead Free No-Clean, Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
3 Weeks
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
CHIPQUIK® SMD4300
Package
Jar
Product Status
Active
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423 ~ 428°F (217 ~ 220°C)
Flux Type
No-Clean, Water Soluble
Wire Gauge
-
Mesh Type
3
Process
Lead Free
Form
Jar, 8.8 oz (250g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
allaboutcomponents.com Storage
Refrigerated
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Weight
0.551 lb (249.93 g)
Base Product Number
SMD4300
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.30.6000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMD4300SNL250T3
Dokumente und Medien
Datasheets
1(SMD4300SNL250T3)
MSDS Material Safety Datasheet
1(SMD4300SNL10(T5), SMD4300SNL250Tx)
Featured Product
1(Solder Paste and Flux)
HTML Datasheet
1(SMD4300SNL250T3)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $55.95
Verpackung: Jar
MinMultiplikator: 1
Verpackung: Jar
MinMultiplikator: 1
Stellvertreter
-