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ChinaSMD291SNL60T4
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
SMD291SNL60T4
BESCHREIBUNG
SN96.5/AG3.0/CU0.5 2-PRT MIX 60G
DETAILIERTE BESCHREIBUNG
Lead Free No-Clean Solder Paste, Two Part Mix Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 2.12 oz (60g)
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
-
Package
Jar
Product Status
Active
Type
Solder Paste, Two Part Mix
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423 ~ 428°F (217 ~ 220°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Jar, 2.12 oz (60g)
Shelf Life
24 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 77°F (3°C ~ 25°C)
Base Product Number
SMD291
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.30.6000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMD291SNL60T4
Dokumente und Medien
Datasheets
1(SMD291SNL60T4)
Video File
1(Chip Quik’s - Patent Pending Two-Part Mix Solder Paste)
MSDS Material Safety Datasheet
1(SMDxSNL, SMDLTLFP SDS)
Featured Product
1(Patent Pending Two-Part Mix™ Solder Paste)
HTML Datasheet
1(SMD291SNL60T4)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $44.95
Verpackung: Jar
MinMultiplikator: 1
Verpackung: Jar
MinMultiplikator: 1
Stellvertreter
-