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ChinaIPC0170-S
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
IPC0170-S
BESCHREIBUNG
BGA-24 (1MM PITCH, 8X6MM BODY) S
DETAILIERTE BESCHREIBUNG
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
2 Weeks
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
Proto-Advantage IPC
Package
Bulk
Product Status
Active
Type
BGA
Number of Positions
24
Pitch
0.039" (1.00mm)
Outer Dimension
1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension
0.315" L x 0.236" W (8.00mm x 6.00mm)
Thermal Center Pad
-
Material
Stainless Steel
Thickness
0.0040" (0.102mm)
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8515.19.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder Stencils, Templates/Chip Quik Inc. IPC0170-S
Dokumente und Medien
Datasheets
()
Video File
1(Prototyping with Solder Stencils - Another Teaching Moment | allaboutcomponents.com Electronics)
HTML Datasheet
1(IPC0170-S)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $11.59
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-