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ChinaDIP600T300P08
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
DIP600T300P08
BESCHREIBUNG
DIP-8 (0.6" BODY) TO DIP-8 (0.3"
DETAILIERTE BESCHREIBUNG
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
Proto-Advantage
Package
Bulk
Product Status
Active
Proto Board Type
DIP to DIP
Package Accepted
-
Number of Positions
8
Pitch
0.100" (2.54mm)
Board Thickness
0.063" (1.60mm)
Material
FR4 Epoxy Glass
Size / Dimension
0.700" L x 0.400" W (17.78mm x 10.16mm)
Base Product Number
DIP600
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8534.00.0070
Andere Namen
-
Kategorie
/Product Index/Prototyping, Fabrication Products/Adapter, Breakout Boards/Chip Quik Inc. DIP600T300P08
Dokumente und Medien
Datasheets
1(DIP600T300P08 Datasheet)
HTML Datasheet
1(DIP600T300P08 Datasheet)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $1.69
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-