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ChinaBGA0023-S
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
BGA0023-S
BESCHREIBUNG
BGA-100 (0.4 MM PITCH, 10 X 10 G
DETAILIERTE BESCHREIBUNG
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
3 Weeks
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
Proto-Advantage BGA
Package
Bulk
Product Status
Active
Type
BGA
Number of Positions
100
Pitch
0.016" (0.40mm)
Outer Dimension
1.950" L x 1.350" W (49.53mm x 34.29mm)
Inner Dimension
-
Thermal Center Pad
-
Material
Stainless Steel
Thickness
0.0040" (0.102mm)
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8534.00.0040
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder Stencils, Templates/Chip Quik Inc. BGA0023-S
Dokumente und Medien
Datasheets
1(BGA0023-S)
Video File
1(Prototyping with Solder Stencils - Another Teaching Moment | allaboutcomponents.com Electronics)
HTML Datasheet
1(BGA0023-S)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $20.99
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-