Übersicht der Teilenummer

TEILNUMMER DES HERSTELLERS
0C97054017
BESCHREIBUNG
RFI EMI GROUNDING MATERIAL 25FT
DETAILIERTE BESCHREIBUNG
HERSTELLER
Laird Technologies EMI
STANDARD LEADTIME
8 Weeks
EDACAD-MODELL
STANDARDPAKET
25

Technische Daten

Mfr
Laird Technologies EMI
Series
All-Purpose
Package
Bulk
Product Status
Active
Type
Fingerstock
Shape
-
Width
0.280" (7.11mm)
Length
16.000" (406.40mm)
Height
0.110" (2.79mm)
Material
Beryllium Copper
Plating
Tin
Plating - Thickness
299.21µin (7.60µm)
Attachment Method
Adhesive
Operating Temperature
121°C
Shelf Life Start
-
Shelf Life
-
Storage/Refrigeration Temperature
-

Umweltverträgliche Exportklassifikationen

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
ECCN
EAR99
HTSUS
4016.93.1050

Andere Namen

-

Kategorie

/Product Index/RF and Wireless/RFI and EMI - Contacts, Fingerstock and Gaskets/Laird Technologies EMI 0C97054017

Dokumente und Medien

Datasheets
1(Low Profile Gasket Catalog)
Video File
1(Laird’s Precision Metals Production and Design Capabilities Overview)
HTML Datasheet
1(Low Profile Gasket Catalog)

Menge Preis

QUANTITÄT: 10
Einzelpreis: $256.279
Verpackung: Bulk
MinMultiplikator: 10

Stellvertreter

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