Übersicht der Teilenummer

TEILNUMMER DES HERSTELLERS
SMDSWLF.020 1LB
BESCHREIBUNG
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
DETAILIERTE BESCHREIBUNG
Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 24 AWG, 25 SWG Spool, 1 lb (454 g)
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET
1

Technische Daten

Mfr
Chip Quik Inc.
Series
-
Package
Bulk
Product Status
Active
Type
Wire Solder
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
0.020" (0.51mm)
Melting Point
423 ~ 428°F (217 ~ 220°C)
Flux Type
No-Clean, Water Soluble
Wire Gauge
24 AWG, 25 SWG
Process
Lead Free
Form
Spool, 1 lb (454 g)
Shelf Life
-
Shelf Life Start
-
Storage/Refrigeration Temperature
-
allaboutcomponents.com Storage
-
Shipping Info
-
Base Product Number
SMDSW

Umweltverträgliche Exportklassifikationen

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.30.6000

Andere Namen

SMDSWLF.020 1LB-ND
SMDSWLF.0201LB

Kategorie

/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMDSWLF.020 1LB

Dokumente und Medien

Datasheets
1(SMDSWLF.020 1LB Datasheet)
MSDS Material Safety Datasheet
1(Lead Free Solder Wire and Spheres SDS)
Featured Product
1(1 lb. Solder Spools)
HTML Datasheet
1(SMDSWLF.020 1LB Datasheet)

Menge Preis

QUANTITÄT: 1
Einzelpreis: $95.67
Verpackung: Bulk
MinMultiplikator: 1

Stellvertreter

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