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Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
110070016
BESCHREIBUNG
RPI HEAT SINK KIT COPPER/ALUM
DETAILIERTE BESCHREIBUNG
Heat Sink Raspberry Pi Aluminum, Copper Heat Spreader Kit, Top Mount
HERSTELLER
Seeed Technology Co., Ltd
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
1
Lagerbestände
Technische Daten
Mfr
Seeed Technology Co., Ltd
Series
-
Package
Bulk
Product Status
Obsolete
Type
Heat Spreader Kit, Top Mount
Package Cooled
Raspberry Pi
Attachment Method
-
Shape
Square
Length
-
Width
-
Diameter
-
Fin Height
-
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Material
Aluminum, Copper
Material Finish
-
Shelf Life
-
Umweltverträgliche Exportklassifikationen
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
EAR99
HTSUS
8473.30.5100
Andere Namen
-
Kategorie
/Product Index/Fans, Thermal Management/Thermal/Heat Sinks/Seeed Technology Co., Ltd 110070016
Dokumente und Medien
Datasheets
1(110070016)
PCN Obsolescence/ EOL
1(DK OBS NOTICE)
HTML Datasheet
1(110070016)
Menge Preis
-
Stellvertreter
-