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ChinaSMD2016
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
SMD2016
BESCHREIBUNG
SOLDER SPHERES SN96.5/AG3.0/CU0.
DETAILIERTE BESCHREIBUNG
Lead Free Solder Sphere Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
3 Weeks
EDACAD-MODELL
STANDARDPAKET
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
SMD2
Package
Bulk
Product Status
Active
Type
Solder Sphere
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
0.008" (0.20mm)
Melting Point
423 ~ 428°F (217 ~ 220°C)
Flux Type
-
Wire Gauge
-
Process
Lead Free
Form
Jar
Shelf Life
24 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
-
Shipping Info
-
Weight
-
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.90.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMD2016
Dokumente und Medien
Datasheets
1(SMD2016 Datasheet)
MSDS Material Safety Datasheet
1(Leaded Solder Wire,Spheres SDS)
Featured Product
1(Small Diameter Solder Spheres)
HTML Datasheet
1(SMD2016 Datasheet)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $126.95
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-