Übersicht der Teilenummer

TEILNUMMER DES HERSTELLERS
2-1571550-1
BESCHREIBUNG
CONN IC DIP SOCKET 6POS GOLD
DETAILIERTE BESCHREIBUNG
6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
HERSTELLER
TE Connectivity AMP Connectors
STANDARD LEADTIME
EDACAD-MODELL
2-1571550-1 Models
STANDARDPAKET

Technische Daten

Mfr
TE Connectivity AMP Connectors
Series
500
Package
Tube
Product Status
Obsolete
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
6 (2 x 3)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
25.0µin (0.63µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
25.0µin (0.63µm)
Contact Material - Post
Beryllium Copper
Housing Material
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Contact Resistance
10mOhm
Base Product Number
1571550

Umweltverträgliche Exportklassifikationen

RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Affected
ECCN
EAR99
HTSUS
8536.69.4040

Andere Namen

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Kategorie

/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 2-1571550-1

Dokumente und Medien

Datasheets
1(1571550)
Environmental Information
1(2-1571550-1 Statement of Compliance)
PCN Obsolescence/ EOL
1(DK OBS NOTICE)
HTML Datasheet
1(1571550)
EDA Models
1(2-1571550-1 Models)
3D Drawings
1(2-1571550-1.pdf)

Menge Preis

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Stellvertreter

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