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China833900T00000
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
833900T00000
BESCHREIBUNG
HEATSINK STAMP 25.9X15X9.5MM
DETAILIERTE BESCHREIBUNG
Heat Sink TO-263 (D²Pak) Copper 2.0W @ 40°C Board Level
HERSTELLER
Comair Rotron
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
50
Lagerbestände
Technische Daten
Mfr
Comair Rotron
Series
-
Package
Bulk
Product Status
Obsolete
Type
Board Level
Package Cooled
TO-263 (D²Pak)
Attachment Method
SMD Pad
Shape
Rectangular, Fins
Length
0.591" (15.00mm)
Width
1.020" (25.91mm)
Diameter
-
Fin Height
0.375" (9.52mm)
Power Dissipation @ Temperature Rise
2.0W @ 40°C
Thermal Resistance @ Forced Air Flow
5.00°C/W @ 400 LFM
Thermal Resistance @ Natural
-
Material
Copper
Material Finish
Tin
Umweltverträgliche Exportklassifikationen
Moisture Sensitivity Level (MSL)
Not Applicable
ECCN
EAR99
HTSUS
8473.30.5100
Andere Namen
CR504
833900T00000-ND
Kategorie
/Product Index/Fans, Thermal Management/Thermal/Heat Sinks/Comair Rotron 833900T00000
Dokumente und Medien
Datasheets
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HTML Datasheet
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Product Drawings
1(833900T00000)
Menge Preis
-
Stellvertreter
-