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ChinaBDN10-5CB/A01
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
BDN10-5CB/A01
BESCHREIBUNG
HEATSINK CPU W/ADHESIVE 1.01"SQ
DETAILIERTE BESCHREIBUNG
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
HERSTELLER
CTS Thermal Management Products
STANDARD LEADTIME
14 Weeks
EDACAD-MODELL
STANDARDPAKET
1,000
Lagerbestände
Technische Daten
Mfr
CTS Thermal Management Products
Series
BDN
Package
Tray
Product Status
Active
Type
Top Mount
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Shape
Square, Pin Fins
Length
1.010" (25.65mm)
Width
1.010" (25.65mm)
Diameter
-
Fin Height
0.555" (14.10mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
6.30°C/W @ 400 LFM
Thermal Resistance @ Natural
20.80°C/W
Material
Aluminum
Material Finish
Black Anodized
Shelf Life
24 Months
Base Product Number
BDN10
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8473.30.5100
California Prop 65
Andere Namen
-
Kategorie
/Product Index/Fans, Thermal Management/Thermal/Heat Sinks/CTS Thermal Management Products BDN10-5CB/A01
Dokumente und Medien
Datasheets
1(BDN Series, Peel-Stick Heat Dissipators)
Environmental Information
()
HTML Datasheet
1(BDN Series, Peel-Stick Heat Dissipators)
Menge Preis
QUANTITÄT: 1000
Einzelpreis: $2.02071
Verpackung: Tray
MinMultiplikator: 1000
Verpackung: Tray
MinMultiplikator: 1000
Stellvertreter
-