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Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
NC191LT50T5
BESCHREIBUNG
SMOOTH FLOW LOW TEMP SOLDER PAST
DETAILIERTE BESCHREIBUNG
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 1.76 oz (50g)
HERSTELLER
Chip Quik Inc.
STANDARD LEADTIME
4 Weeks
EDACAD-MODELL
STANDARDPAKET
1
Lagerbestände
Technische Daten
Mfr
Chip Quik Inc.
Series
Smooth Flow™
Package
Bulk
Product Status
Active
Type
Solder Paste
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter
-
Melting Point
280°F (138°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
5
Process
Lead Free
Form
Jar, 1.76 oz (50g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
allaboutcomponents.com Storage
Refrigerated
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Base Product Number
NC191
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
3810.10.0000
Andere Namen
-
Kategorie
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. NC191LT50T5
Dokumente und Medien
Datasheets
1(NC191LT50T5 Datasheet)
MSDS Material Safety Datasheet
1(NC191LT50T5 SDS)
HTML Datasheet
1(NC191LT50T5 Datasheet)
Menge Preis
QUANTITÄT: 1
Einzelpreis: $27.95
Verpackung: Bulk
MinMultiplikator: 1
Verpackung: Bulk
MinMultiplikator: 1
Stellvertreter
-